Housing apparatus and method
AssigneeAmino Communications Limited
InventorJames St. Valentine WESTWOOD
Life of this patent
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Abstract
A housing is described which is configured to dissipate heat from one or more heat sources within the housing and which comprises and inner layer and an outer layer. The outer layer comprises a material with a lower thermal conductivity than the inner layer. The outer layer is configured to have an overall thermal insulance of at least 2.5×10−3 Km2 W−1 at 20° C. A part of the inner layer and a part of the outer layer are spaced apart from each other and define a receptacle for wireless communication components. In another embodiment the housing comprises an air gap between the inner layer and the outer layer. The air gap and the outer layer together are configured to have an overall thermal insulance of at least 2.5×10−3 Km2 W−1 at 20° C.
Claims20
A housing configured to dissipate heat from one or more heat sources within the housing, wherein the housing comprises:
- an inner layer comprising a first material;
- and
- an outer layer comprising a second material, the second material having a lower thermal conductivity than the first material;
- wherein the outer layer is configured to have an overall thermal insulance of at least 2.5×10−3 Km2 W−1 at 20° C.;
- and wherein a part of the inner layer and a part of the outer layer are spaced apart from each other and define a receptacle for wireless communication components.
A housing configured to dissipate heat from one or more heat sources within the housing, wherein the housing comprises:
- an inner layer comprising a first material;
- an outer layer comprising a second material, the second material having a lower thermal conductivity than the first material;
- and
- an air gap between the inner layer and the outer layer;
- wherein the air gap and the outer layer together are configured to have an overall thermal insulance of at least 2.5×10−3 Km2 W−1 at 20° C.
An apparatus comprising:
- a housing comprising:
- an inner layer comprising a first material;
- and
- an outer layer comprising a second material, the second material having a lower thermal conductivity than the first material;
- wherein the outer layer is configured to have an overall thermal insulance of at least 2.5×10−3 Km2 W−1 at 20° C.;
- and wherein a part of the inner layer and a part of the outer layer are spaced apart from each other and define a receptacle for wireless communication components;
- and
- one or more components within the housing, wherein the one or more components generate heat in operation.
Dependencies are inferred from the claim text.