Flexible powered cards and devices, and methods of manufacturing flexible powered cards and devices

Abstract

A flexible device, such as a powered card or processor based system, may include a flexible assembly. The flexible assembly may include a die adhered to a flexible substrate (e.g., a PCB) by a flexible adhesive. The die may be stacked with other dies that may be adhered to each other with a flexible adhesive. A conductive pad may be between a flexible substrate and a flexible adhesive. Bond wires may interconnect one or more dies and the flexible substrate via bond pads. In a stacked die configuration, the dies may be thinned using a thinning and/or a polishing process. Such thinned dies may be flexible. The flexible assembly may be flexibly encapsulated.

Dependencies are inferred from the claim text.