Multilayer ceramic electronic component

A multilayer ceramic electronic component, comprising:

• external electrodes including first and second external electrodes formed on end surfaces of a ceramic body;
• internal electrodes including first and second internal electrodes separated from each other and laminated in the interior of the ceramic body, the first and second internal electrodes being connected to the first and second external electrodes, respectively;
• and
• buffer layers formed from the end surfaces of the ceramic body in an interior direction of the ceramic body,
• wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te≦0.6 μm, N>200, and 3 μm≦t<L.

A method of manufacturing a multilayer ceramic electronic component, the method comprising:

• preparing a paste for external electrodes, containing glass;
• forming external electrodes on a sintered chip, in which internal electrodes are laminated, by using the paste for external electrodes;
• and
• sintering the external electrodes by regulating a temperature increase rate at a softening point of the glass or higher to control thickness of buffer layers.

A method of manufacturing a multilayer ceramic electronic component, the method comprising:

• preparing a paste for external electrodes, containing glass;
• forming external electrodes on a sintered chip, in which internal electrodes are laminated, by using the paste for external electrodes;
• and
• sintering the external electrodes,
• wherein in the preparing of the paste for external electrodes, thickness of buffer layers is controlled by regulating contents of an alkali metal and vanadium oxide contained in the glass.