Sealed crystal oscillator and semiconductor package including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJae-Jin Park, Hee-Seok Lee, Ji-Hwan Hyun, Kang-Yeop Choo
Life of this patent
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Abstract
A semiconductor package includes a package substrate; an integrated circuit chip formed on one surface of the package substrate; and a sealed quartz oscillator formed on at least one of an inside, one surface, and the other surface of the package substrate, wherein the sealed quartz oscillator includes a substrate, a quartz blank formed on one surface of the substrate, and a sealing cap covering at least one surface of the quartz blank and including metal.
Claims29
A semiconductor package comprising:
- a package substrate;
- an integrated circuit chip disposed on one surface of the package substrate;
- and
- a sealed quartz oscillator disposed on at least one of an interior portion, a first exterior surface, and a second exterior surface opposite the first surface of the package substrate,
- wherein the sealed quartz oscillator includes a substrate, a quartz blank disposed on one surface of the substrate, and a sealing cap covering at least one surface of the quartz blank, wherein the sealing cap comprises metal.
A sealed semiconductor package having a built-in sealed quartz oscillator, wherein the sealed quartz oscillator comprises:
- a first substrate;
- a second substrate disposed on a part of the first substrate;
- a quartz blank disposed in a space that is formed by the first substrate and the second substrate;
- a sealing cap disposed on the second substrate, covering one surface of the quartz blank, and comprising metal;
- and
- a bonding portion formed by melting of a metal material to bond the second substrate and the sealing cap together.
A semiconductor package having a built-in sealed quartz oscillator, wherein the sealed quartz oscillator comprises:
- a quartz blank;
- a substrate including a plurality of through-electrodes which are electrically connected to the quartz blank;
- and
- a sealing cap covering at least one surface of the quartz blank and including metal,
- wherein at least one of the plurality of through-electrodes is positioned adjacent to a side surface or an upper surface of the quartz blank.
A sealed quartz oscillator built in a semiconductor package, comprising:
- a substrate;
- a quartz blank disposed on one surface of the substrate;
- and
- a sealing cap covering at least one surface of the quartz blank and comprising metal.
A semiconductor package having a sealed quartz oscillator, wherein the sealed quartz oscillator comprises:
- a substrate;
- a quartz blank disposed on one surface of the substrate;
- and
- a sealing cap covering at least one surface of the quartz blank and comprising metal,
- a plurality of electrode patterns electrically connected to the quartz blank disposed on the substrate, and
- a plurality of through-electrodes electrically connected to the plurality of electrode patterns disposed through the substrate, respectively.
Dependencies are inferred from the claim text.