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US 2014/0232293 A1Published application
Light-emitting device package
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-hyuck KAM, Gam-han YONG, Sang-hyun LEE, Seong-deok HWANG
Life of this patent
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Abstract
The present application provides a light-emitting device package. The light-emitting device package includes a package substrate includes at least one via hole. A light-emitting device is mounted on the package substrate so as to overlap with the via hole. A bonding layer is formed between the light-emitting device and the package substrate and includes a eutectic bonding material.
Claims20
A light-emitting device package, comprising:
- a package substrate including at least one via hole;
- a light-emitting device mounted on the package substrate, the light-emitting device overlapping with the at least one via hole;
- and
- a bonding layer formed between the light-emitting device and the package substrate, the bonding layer including a eutectic bonding material.
1 more element
A light-emitting device package, comprising:
- a package substrate having a plurality of light-emitting device mounting areas;
- and
- a plurality of light-emitting devices respectively mounted in the plurality of light-emitting device mounting areas,
- wherein a plurality of via holes pass through the package substrate, and
- each of the plurality of via holes is formed in each of the plurality of light-emitting device mounting areas of the package substrate.
2 more elements
A light-emitting device system comprising:
- a power supply unit for supplying power;
- one or more light-emitting device packages which receive power from the power supply unit, each package including:
- a package substrate including at least one via hole;
- a light-emitting device mounted on the package substrate, the light-emitting device overlapping with the at least one via hole;
- a bonding layer formed between the light-emitting device and the package substrate, the bonding layer including a eutectic bonding material;
- a lens for covering each of the light-emitting devices;
- and
- at least one bonding wire for electrically connecting an upper surface of each light-emitting device to wiring associated with the package substrate.
5 more elements
Dependencies are inferred from the claim text.