Identification mechanism for semiconductor device die
AssigneeFreescale Semiconductor, Inc.
InventorsCOLBY G. RAMPLEY, LAWRENCE S. KLINGBEIL
Life of this patent
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Abstract
A method and system for uniquely identifying each semiconductor device die from a wafer is provided. Identifying features are associated with device die bond pads. In one embodiment, one or more tab features are patterned and associated with each of one or more device die bond pads. These features can represent a code (e.g., binary or ternary) that uniquely identifies each device die on the wafer. Each tab feature can be the same shape or different shapes, depending upon the nature of coding desired. Alternatively, portions of the one or more device die bond pads can be omitted as a mechanism for providing coded information, rather than adding portions to the device die bond pads.
Claims14
1-12. (canceled)
A die located on a semiconductor wafer, the die comprising:
- a first bond pad located in a bond pad region;
- and
- one or more bond pad features coupled to the first bond pad, wherein an aspect of the one or more bond pad features provides information associated with the die.
A semiconductor wafer comprising:
- a plurality of integrated circuit dies formed on the semiconductor wafer, wherein each integrated circuit die comprises
- one or more bond pads located on the integrated circuit die,
- a first set of the one or more bond pads configured to provide unique information associated with the integrated circuit die by virtue of comprising one or more bond pad features associated with one or more bond pads of the first set of bond pads.
Dependencies are inferred from the claim text.