US 2014/0232016 A1 · SEMICONDUCTOR DEVICE

Abstract

This semiconductor device includes: a first metal plate; a plurality of semiconductor elements mounted on the first metal plate; a spacer that is connected to a surface on the opposite side to the surface where the plurality of semiconductor elements are mounted on the first metal plate; a second metal plate that is connected to a surface on the opposite side to the surface where the spacer is connected to the semiconductor elements; and an encapsulating resin between the first plate and the second plate that seals the plurality of semiconductor elements. Stress due to contraction that occurs in the encapsulating resin between the plurality of semiconductor elements is relaxed to a greater extent than stress due to contraction that occurs in the encapsulating resin in the locations other than the location between the plurality of semiconductor devices.

Claims17

Dependent claims

A semiconductor device comprising:

a first metal plate;
plural semiconductor elements mounted on the first metal plate;
a spacer connected to surfaces opposite from mounted surfaces of the plural semiconductor elements on the first metal plate;
a second metal plate connected to a surface opposite from a connected surface of the spacer to the semiconductor elements;
and
an encapsulating resin configured to seal the plural semiconductor elements between the first metal plate and the second metal plate,
wherein the encapsulating resin is configured of a thermosetting resin and is contracted after thermal curing,
first stress generated by contraction of the encapsulating resin between the plural semiconductor elements is relaxed to a greater extent than second stress generated by the contraction of the encapsulating resin in a portion other than that between the plural semiconductor elements.

5 more elements

Dependencies are inferred from the claim text.

Semiconductor device

Life of this patent

Semiconductor device

Life of this patent

Abstract

Claims17