Semiconductor Modules and Methods of Formation Thereof

A method of forming a semiconductor module, the method comprising:

• providing a semiconductor package comprising a semiconductor die disposed in a first encapsulant;
• forming an opening in the first encapsulant of the semiconductor package to expose a plurality of contact metallization of the semiconductor die;
• forming contact pads over the plurality of contact metallization;
• placing a semiconductor component within the opening;
• and
• attaching the semiconductor component to the contact pads.

A method of forming a semiconductor module, the method comprising:

• providing a semiconductor package comprising:
• a plurality of leads;
• a first semiconductor die supported by a die paddle and disposed in a first encapsulant,
• a clip coupling a region to a lead of the plurality of leads of the semiconductor package;
• forming an opening in the first encapsulant of the semiconductor package to expose a portion of a top surface of the clip;
• placing a semiconductor component within the opening;
• and
• attaching the semiconductor component to the exposed portion of the top surface of the clip.

A method of forming a semiconductor module, the method comprising:

• providing a first semiconductor package comprising a first semiconductor die disposed in a first encapsulant;
• forming an opening in the first encapsulant;
• and
• providing a second semiconductor package comprising a second semiconductor die disposed in a second encapsulant, wherein the second semiconductor package is disposed at least partially within the opening in the first encapsulant.

A method of forming a semiconductor module, the method comprising:

• providing a semiconductor package comprising a first semiconductor die disposed in a first encapsulant;
• forming an opening in the first encapsulant;
• and
• attaching a second semiconductor die at least partially within the opening in the first encapsulant.