Schemes for Forming Barrier Layers for Copper in Interconnect Structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Hai-Ching Chen, Tien-I Bao
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Abstract
A method of forming a semiconductor structure includes providing a substrate; forming a low-k dielectric layer over the substrate; embedding a conductive wiring into the low-k dielectric layer; and thermal soaking the conductive wiring in a carbon-containing silane-based chemical to form a barrier layer on the conductive wiring. A lining barrier layer is formed in the opening for embedding the conductive wiring. The lining barrier layer may comprise same materials as the barrier layer, and the lining barrier layer may be recessed before forming the barrier layer and may contain a metal that can be silicided.
Claims20
A semiconductor device comprising:
- a dielectric layer over a substrate;
- a conductive wire embedded within the dielectric layer, the conductive wire comprising a conductive material;
- a first barrier layer between the dielectric layer and the conductive wire;
- and
- a capping layer over the conductive wire, the capping layer comprising the conductive material and a carbon-containing silane derivative.
A semiconductor device comprising:
- a dielectric material over a substrate;
- an opening within the dielectric material;
- a first barrier layer at least partially lining the opening within the dielectric material;
- a conductive material adjacent to the first barrier layer;
- and
- a capping layer over the conductive material, wherein the capping layer comprises the conductive material and a carbon containing silane derivative.
A semiconductor device comprising:
- a conductor over a substrate, the conductor comprising a first material;
- a barrier layer adjacent to sidewalls of the conductor;
- a dielectric material adjacent to the barrier layer;
- and
- a capping layer in physical contact with the conductor, wherein the capping layer comprises the first material and a carbon-containing silane derivative.
Dependencies are inferred from the claim text.