Stacked type semiconductor device and printed circuit board

A printed circuit board comprising:

• a printed wiring board where a first electrode pad is formed on one surface;
• a semiconductor device mounted on the printed wiring board, the semiconductor device including
• a semiconductor element, and
• an interposer where the semiconductor element is mounted and a second electrode pad is formed on a surface facing the printed wiring board;
• and
• a joint material configured to bond the first electrode pad and the second electrode pad together,
• wherein a solder layer and a metal layer bonded to at least one of the first and the second electrode pads are stacked in the joint material,
• wherein the metal layer includes a metal particle aggregate in which a plurality of metal particles are integrated with voids, and solder which fills the voids in the metal particle aggregate.

A printed circuit board comprising:

• a stacked type semiconductor device including
• a first semiconductor device including
• a first semiconductor element, and
• a first interposer where the first semiconductor element is mounted, a first electrode pad is formed on one surface, and an external electrode for connecting to the outside is formed on the other surface,
• a second semiconductor device stacked on the first semiconductor device, the second semiconductor device including
• a second semiconductor element, and
• a second interposer where the second semiconductor element is mounted and a second electrode pad is formed on a surface facing the first interposer, and
• a joint material configured to bond the first electrode pad and the second electrode pad together;
• and
• a printed wiring board where a third electrode pad is formed on one surface and the stacked type semiconductor device is mounted by bonding the external electrode to the third electrode pad,
• wherein a solder layer and a metal layer bonded to at least one of the first and the second electrode pads are stacked in the external electrode,
• wherein the metal layer includes a metal particle aggregate in which a plurality of metal particles are integrated with voids, and solder which fills the voids in the metal particle aggregate.

A printed circuit board comprising:

• a stacked type semiconductor device including
• a first semiconductor device including
• a first semiconductor element, and
• a first interposer where the first semiconductor element is mounted, a first electrode pad is formed on one surface, and an external electrode for connecting to the outside is formed on the other surface,
• a second semiconductor device stacked on the first semiconductor device, the second semiconductor device including
• a second semiconductor element, and
• a second interposer where the second semiconductor element is mounted and a second electrode pad is formed on a surface facing the first interposer, and
• a joint material configured to bond the first electrode pad and the second electrode pad together;
• and
• a printed wiring board where a third electrode pad is formed on one surface and the stacked type semiconductor device is mounted by bonding the external electrode to the third electrode pad,
• wherein a solder layer and a metal layer bonded to at least one of the first and the second electrode pads are stacked in the joint material,
• wherein the metal layer includes a metal particle aggregate in which a plurality of metal particles are integrated with voids, and solder which fills the voids in the metal particle aggregate.

A joint structure of a printed circuit board, the joint structure comprising:

• a first wiring board where a first electrode pad is formed on one surface;
• a second wiring board where a second electrode pad is formed on one surface facing the first wiring board;
• and
• a joint material configured to bond the first electrode pad and the second electrode pad together,
• wherein a solder layer and a metal layer bonded to at least one of the first and the second electrode pads are stacked in the joint material,
• wherein the metal layer includes a metal particle aggregate in which a plurality of metal particles are integrated with voids, and solder which fills the voids in the metal particle aggregate.