Semiconductor device, and method of manufacturing device
OwnerYuichi ANDO, Yukito Sato +1inventors
InventorsYuichi ANDO, Yukito Sato, Katsunori Mae
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Abstract
A device including a first substrate in which a functional element and an electrode are formed; a second substrate in which a through electrode is formed; a joining material that joins the first substrate and the second substrate while reserving a predetermined space between the functional element and the second substrate; and a conductive material that electrically connects the electrode to the through electrode. Here, the joining material is harder than the conductive material, and the joining material is electrically less conductive than the conductive material.
Claims14
A semiconductor device comprising:
- a first substrate in which a functional element and an electrode are formed;
- a second substrate in which a through electrode is formed;
- a joining material that joins the first substrate and the second substrate, while reserving a predetermined space between the functional element and the second substrate;
- and
- a conductive material that electrically connects the electrode to the through electrode,
- wherein the joining material is harder than the conductive material, and the joining material is electrically less conductive than the conductive material.
A method of manufacturing a device, the method comprising:
- a step of forming a functional element and an electrode on a first substrate;
- a step of forming a conductive material on the electrode;
- a step of forming a through electrode in a second substrate;
- a step of forming a joining material on the second substrate, wherein the joining material is harder than the conductive material, and the joining material is electrically less conductive than the conductive material;
- a step of joining the first substrate and the second substrate through the joining material, while reserving a predetermined space between the functional element and the second substrate;
- and
- a step of electrically connecting the electrode to the through electrode through the conductive material.
A method of manufacturing a device, the method comprising:
- a step of forming a functional element and an electrode on a first substrate;
- a step of forming a conductive material on the electrode;
- a step of forming a through electrode in a second substrate;
- a step of forming a joining material on the second substrate, wherein the joining material is harder than the conductive material, and the joining material is electrically less conductive than the conductive material,
- a step of baking the conductive material and the joining material, while reserving a predetermined space between the functional element and the second substrate;
- a step of joining the first substrate and the second substrate through the joining material;
- and
- a step of electrically connecting the electrode and the through electrode through the conductive material.
Dependencies are inferred from the claim text.