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US 2014/0231987 A1Published application
Connector Structures of Integrated Circuits
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShang-Yun Tu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Cheng Kuo, Chen-Shien Chen
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Abstract
A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.
Claims20
A package comprising:
- a die having a center, wherein the die comprises:
- a first metal pad, wherein in a top view of the die, the first metal pad has a first center having a first distance from the center of the die;
- a passivation layer covering edge portions of the first metal pad;
- and
- a first metal pillar overlapping a portion of the first metal pad, with the first metal pillar being a non-solder metal pillar, wherein the first metal pillar is electrically coupled to the first metal pad through an opening in the passivation layer, and the first metal pillar has a second center having a second distance from the center of the die.
2 more elements
A package comprising:
- a die comprising:
- a first metal pad having a first center in a top view of the die;
- a passivation layer over the first metal pad;
- a polymer layer over the passivation layer;
- and
- a first electrical connector extending into the passivation layer and the polymer layer to electrically couple to the first metal pad, wherein the first electrical connector has a second center in the top view of the die, with the second center misaligned with the first center;
- a package component comprising an additional metal pad;
- and
- a solder region bonding the first electrical connector to the additional metal pad of the package component.
6 more elements
A package comprising:
- a die comprising:
- a first metal pad having a first center in a top view of the die;
- a passivation layer comprising a portion over the first metal pad;
- an Under-Bump Metallurgy (UBM) extending into the passivation layer to contact the first metal pad;
- and
- a non-solder metal pillar over and contacting the UBM, wherein the non-solder metal pillar has a second center in the top view of the die, with the second center misaligned with the first center;
- a package substrate comprising a second metal pad;
- and
- a solder region bonding the non-solder metal pillar to the second metal pad.
6 more elements
Dependencies are inferred from the claim text.