Semiconductor chip package structure

A semiconductor chip package structure, comprising:

• a substrate having a chip connecting portion;
• at least one metal wire disposed on the substrate and extending from an outside of the chip connecting portion to an inside of the chip connecting portion, and the metal wire having a contact pad disposed in the chip connecting portion;
• an insulating layer disposed on the metal wire, and the insulating layer having an opening to expose the contact pad;
• an organic insulating material disposed on the insulating layer of an outside edge of the chip connecting portion;
• an anisotropic conductive film (ACF) covering the chip connecting portion and a portion of the organic insulating material;
• and
• is a semiconductor chip disposed on the ACF of the chip connecting portion, wherein a bump of the semiconductor chip is electrically connected to the contact pad through the ACF.