Stacked assembly of a mems integrated device having a reduced thickness

An electronic apparatus, comprising:

• a base substrate having a first surface;
• a first body including semiconductor material and integrating a micromechanical structure on a first surface, the first body located on the first surface of the base substrate;
• a cap located over the first surface, at least one of said first body, said base substrate, and said cap having a recess;
• a second body including semiconductor material and integrating at least one electronic component that is electrically coupled to said micromechanical structure, said second body being located in the recess, the second body being stacked in a direction that is transverse to the first surface of the base substrate;
• a molding compound covering a portion of the first body, the second body, and the first surface of the base substrate;
• and
• a printed circuit board electrically coupled to said base substrate.

A method for assembling a MEMS integrated device, the method comprising:

• forming a recess in at least one of a base substrate and a first body of semiconductor material that integrates a micromechanical structure;
• coupling said first body to a surface of said base substrate;
• placing at least part of a second body of semiconductor material that integrates at least one electronic component in the recess;
• electrically coupling said at least one electronic component to said micromechanical structure;
• coupling said base substrate to said first body;
• and
• forming a coating on said surface of said base substrate.