Method for producing a solder joint
AssigneeRobert Bosch GmbH
InventorsDaniel Michels, Simon Green
Life of this patent
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Abstract
The invention relates to a method for producing a solder joint between at least one base part (2) and at least one first component (3), comprising the following steps: providing the base part (2); partially blasting a surface of the base part (2) using a SACO blasting agent, the blasting material (50) of which has a silicate coating (52), in such a way that a SACO-blasted region (20) and a non-blasted positioning region (40) are present; and soldering the at least first component (3) onto the non-blasted positioning region (40), wherein the SACO-blasted region (20) acts as a solder resist.
Claims11
A method for producing a solder joint between at least one base part (2) and at least one first component (3), comprising the following steps:
- providing the base part (2),
- partially blasting a surface of the base part (2) using a SACO blasting agent, a blasting material (50) of which has a silicate coating (52), in such a way that a SACO-blasted region (20) and a non-blasted positioning region (40) are present, and
- soldering the at least first component (3) onto the non-blasted positioning region (40),
- wherein the SACO-blasted region (20) acts as a solder resist.
An electronic assembly comprising:
- at least one first component (3) and
- a base part (2),
- wherein the base part (2) comprises at least one region (20) blasted using a SACO blasting agent, the a blasted material of which has a silicate coating, and at least one non-blasted positioning region (40),
- wherein the component (3) is soldered onto the non-blasted positioning region (40),
- wherein silicate particles adhere to the SACO-blasted region (20) and wherein the SACO-blasted region (20) is not wettable with solder.
Dependencies are inferred from the claim text.