Semiconductor device including electromagnetic absorption and shielding
AssigneeSanDisk Information Technology (Shanghai) Co., Ltd.
InventorsDacheng Huang, Ye Bai, Kaiyou Qian, Chin-Tien Chiu
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Abstract
A semiconductor device is disclosed including material for absorbing EMI and/or RFI The device includes a substrate (202), one or more semiconductor die (224,225), and molding compound around the one or more semiconductor die (224,225). The material for absorbing EMI and/or RFI may be provided within or on a solder mask layer (210) on the substrate (202). The device may further include EMI/RFI-absorbing material around the molding compound and in contact with the EMI/RFI-absorbing material on the substrate to completely enclose the one or more semiconductor die in EMI/RFI-absorbing material.
Claims30
A semiconductor device, comprising:
- a substrate including a dielectric core, a conductive layer on the dielectric core, and a solder mask layer on the conductive layer, the substrate including an absorbing material for absorbing at least one of EMI and RFI;
- and
- one or more semiconductor die affixed to the substrate.
A semiconductor device, comprising:
- a substrate;
- a solder mask layer on the substrate, the solder mask layer including a first absorbing material for absorbing at least one of EMI and RFI;
- one or more semiconductor die affixed and electrically connected to the substrate;
- a molding compound encapsulating at least the one or more semiconductor die;
- and
- a layer provided on the molding compound, the layer including a second absorbing material for absorbing at least one of EMI and RFI.
A semiconductor device, comprising:
- a substrate;
- a solder mask layer on the substrate, the solder mask layer including a first absorbing material for absorbing at least one of EMI and RFI;
- one or more semiconductor die affixed and electrically connected to the substrate;
- a molding compound encapsulating at least the one or more semiconductor die;
- and
- first and second layers provided on the molding compound, the first layer including a second absorbing material for absorbing at least one of EMI and RFI, and the second layer including a conductive material for shielding the semiconductor device against at least one of EMI and RFI.
A method of shielding a semiconductor device from at least one of EMI and RFI, comprising the steps of:
- (a) mounting one or more semiconductor die on a substrate;
- (b) encapsulating the one or more semiconductor die on the substrate in molding compound;
- and
- (c) completely encapsulating the one or more semiconductor die in one or more layers of absorbing material that absorb at least one of EMI and RFI.
Dependencies are inferred from the claim text.