Multi-chip package and method for manufacturing the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsTai-Tsung Hsu, Cheng-Yu Chiang, Miao-Wen Chen, Wen-Jung Chiang, Hsin-Hung Lee
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Abstract
A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.
Claims18
A multi-chip package, comprising:
- a substrate having a grounding structure;
- two semiconductor elements disposed on and electrically connected to the substrate;
- an encapsulant formed on the substrate and encapsulating the semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements;
- and
- an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure.
A multi-chip package, comprising:
- a substrate having a grounding layer;
- two semiconductor elements disposed on and electrically connected to the substrate;
- an encapsulant formed on the substrate and encapsulating the semiconductor elements, wherein the encapsulant has a plurality of round holes penetrating the encapsulant and substrate and formed between the semiconductor elements;
- and
- an electromagnetic shielding structure formed in each of the round holes and connected to the grounding layer.
A method for manufacturing a multi-chip package, comprising:
- forming an encapsulant on a substrate having two semiconductor elements disposed thereon such that the semiconductor elements are embedded in the encapsulant, wherein the substrate has a grounding structure;
- forming a plurality of round holes disposed between the semiconductor elements and penetrating the encapsulant;
- and
- forming an electromagnetic shielding structure in each of the round holes and connecting the electromagnetic shielding structure to the grounding structure.
A method for manufacturing a multi-chip package, comprising:
- forming an encapsulant on a substrate having two semiconductor elements disposed thereon such that the semiconductor elements are embedded in the encapsulant, wherein the substrate has a grounding layer;
- forming a plurality of round holes disposed between the semiconductor elements and penetrating the encapsulant and substrate;
- and
- forming an electromagnetic shielding structure in each of the round holes and connecting the electromagnetic shielding structure to the grounding layer.
Dependencies are inferred from the claim text.