Chip arrangement and a method of manufacturing a chip arrangement
AssigneeInfineon Technologies AG
InventorsHorst Theuss, Beng Keh See
Life of this patent
Estimating the term…
Abstract
In various embodiments, a chip arrangement may be provided. The chip arrangement may include a metallic carrier. The chip arrangement may also include at least one chip arranged on the metallic carrier, wherein the at least one chip includes a chip contact, wherein the chip contact is electrically coupled to the metallic carrier. The chip arrangement may also include encapsulation material at least partially encapsulating the at least one chip. The chip arrangement may also include an electrically conductive shielding structure formed over at least a portion of the encapsulation material to electrically contact the metallic carrier.
Claims25
A chip arrangement, comprising:
- a metallic carrier;
- at least one chip arranged on the metallic carrier, wherein the at least one chip comprises a chip contact, wherein the chip contact is electrically coupled to the metallic carrier;
- encapsulation material at least partially encapsulating the at least one chip;
- and
- an electrically conductive shielding structure formed over at least a portion of the encapsulation material to electrically contact the metallic carrier.
A chip arrangement, comprising:
- a metallic carrier;
- at least one chip arranged on the metallic carrier, wherein the at least one chip comprises a chip contact, wherein the chip contact is electrically coupled to the metallic carrier;
- encapsulation material at least partially encapsulating the at least one chip, wherein at least a portion of the metallic carrier is free from the encapsulation material;
- and
- an electrically conductive shielding structure formed over at least a portion of the encapsulation material to electrically contact the metallic carrier via the portion of the metallic carrier which is free from the encapsulation material.
A method for manufacturing a chip arrangement, the method comprising:
- arranging at least one chip on a metallic carrier, wherein the at least one chip comprises a chip contact;
- electrically coupling the chip contact to the metallic carrier;
- at least partially encapsulating the at least one chip with encapsulation material;
- and
- forming an electrically conductive shielding structure over at least a portion of the encapsulation material to electrically contact the metallic carrier.
Dependencies are inferred from the claim text.