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US 2014/0231966 A1Published application
Chip package and method for forming the same
AssigneeXintec Inc.
InventorsBai-Yao LOU, Tsang-Yu LIU, Chia-Sheng LIN, Tzu-Hsiang HUNG
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Abstract
An embodiment of the invention provides a chip package which includes a substrate having a first surface and a second surface; a conducting pad structure located on the first surface; a dielectric layer located on the first surface of the substrate and the conducting pad structure, wherein the dielectric layer has an opening exposing a portion of the conducting pad structure; and a cap layer located on the dielectric layer and filled into the opening.
Claims20
A chip package, comprising:
- a semiconductor substrate having a first surface and a second surface;
- a conducting pad structure located on the first surface of the semiconductor substrate;
- a dielectric layer located on the first surface of the semiconductor substrate and the conducting pad structure, wherein the dielectric layer has an opening exposing a portion of the conducting pad structure;
- a cap layer located on the dielectric layer and filled into the opening;
- a hole extending from the second surface toward the first surface of the semiconductor substrate and exposing a portion of the conducting pad structure;
- an insulating layer located on a sidewall of the hole;
- and
- a conducting layer located on the insulating layer on the sidewall of the hole, wherein the conducting layer electrically contacts with the conducting pad structure.
5 more elements
A method for forming a chip package, comprising:
- providing a semiconductor substrate having a first surface and a second surface, wherein a conducting pad structure and a dielectric layer are disposed on the first surface, and the dielectric layer is located on the conducting pad structure and has an opening exposing a portion of the conducting pad structure;
- locating a cap layer on the dielectric layer and filled into the opening;
- removing a portion of the semiconductor substrate from the second surface of the semiconductor substrate to form a hole extending toward the first surface, wherein the hole exposes a portion of the conducting pad structure;
- forming an insulating layer on a sidewall of the hole;
- and
- forming a conducting layer on the insulating layer on the sidewall of the hole, wherein the conducting layer electrically contacts with the conducting pad structure.
3 more elements
Dependencies are inferred from the claim text.