Micro-electro-mechanical device with buried conductive regions, and manufacturing process thereof

A method for manufacturing a MEMS device, the method comprising:

• over a body, forming an electrical-connection region that includes a first semiconductor material layer, a composite layer of a binary compound of a semiconductor material and of a transition metal, and a second semiconductor material layer on the composite layer;
• forming a sacrificial layer on the electrical-connection region;
• forming an anchoring opening in the sacrificial layer exposing at least a portion of the electrical-connection region;
• forming a structural layer on the sacrificial layer and in the anchoring opening;
• defining mobile and fixed structures in the structural layer;
• and
• at least partially removing the sacrificial layer and releasing portions of the mobile and fixed structures.

An electronic device comprising:

• a MEMS that includes:
• a substrate;
• a cavity above the substrate;
• first and second anchoring regions;
• a mobile structure above the cavity and coupled to the substrate by the first anchoring regions;
• a fixed structure coupled to the substrate by the second anchoring regions;
• a first electrical-connection region between the substrate and the first anchoring region and electrically coupled to the mobile structure;
• and
• a second electrical-connection region between the substrate and the second anchoring region and electrically coupled to the fixed structure, wherein the first and second electrical-connection regions have a conductive multilayer that includes a first semiconductor material layer, a composite layer of a binary compound of a semiconductor material and of a transition metal, and a second semiconductor material layer.