Method and Apparatus for Image Sensor Packaging
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSzu-Ying Chen, Meng-Hsun Wan, Dun-Nian Yaung, Pao-Tung Chen, Jen-Cheng Liu
Life of this patent
Estimating the term…
Abstract
A backside illuminated image sensor comprises a photodiode and a first transistor in a sensor region and located in a first substrate, wherein the first transistor is electrically coupled to the photodiode. The image sensor further comprises a plurality of logic circuits formed in a second substrate, wherein the second substrate is stacked on the first substrate and the logic circuit are coupled to the first transistor through a plurality of bonding pads, the bonding pads disposed outside of the sensor region.
Claims21
A device comprising:
- a sensor die comprising
- a sensor region;
- a plurality of pixels disposed within the sensor region;
- and
- a plurality of sensor bond pads disposed outside the sensor region, each of the plurality of sensor bond pads having a surface exposed through a frontside of the sensor die;
- and
- a control circuit die comprising:
- at least one sensor control circuit;
- and
- a plurality of control circuit bond pads, each of the plurality of control circuit bond pads bonded to at least one of the plurality of sensor bond pads.
A sensor device comprising:
- a sensor region;
- a plurality of backside illuminated pixels disposed within the sensor region;
- a plurality of sensor bond pads disposed outside the sensor region, each of the plurality of sensor bond pads having an exposed surface;
- a plurality of row select lines, each of the plurality of row select lines electrically connected to a plurality of pixels in a row and extending from within the sensor region to outside of the sensor region, each of the plurality of row select lines further electrically connected to a sensor bond pad;
- and
- a plurality of output lines, each of the plurality of output lines electrically connected to a plurality of pixels in a column extending from within the sensor region to outside of the sensor region, each of the plurality of output lines electrically connected to a sensor bond pad.
15-20. (canceled)
A device, comprising:
- a plurality of backside illuminated pixels disposed within a sensor region of a sensor die;
- a plurality of sensor bond pads disposed in the sensor die and outside the sensor region, each of the plurality of sensor bond pads having a surface exposed at the frontside of the sensor die;
- a plurality of row select lines, each of the plurality of row select lines electrically connecting a plurality of the pixels in a row to a respective one of the plurality of sensor bond pads;
- a plurality of output lines, each of the plurality of output lines electrically connecting a plurality of pixels in a column to a respective one of the plurality of sensor bond pads, at least one sensor control circuit disposed in a control circuit die;
- and
- a plurality of control circuit bond pads disposed in the control circuit die, each of the control circuit bond pads having a surface exposed at a frontside of the control circuit die;
- wherein each of the plurality of control circuit bond pads are coupled to a respective one of the plurality of sensor bond pads;
- and
- wherein the sensor region is substantially free of metal features exposed at the frontside of the sensor die.
Dependencies are inferred from the claim text.