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US 2014/0231858 A1Published application
LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount
AssigneeLextar Electronics Corporation
InventorsChia-En Lee, Cheng-Ta Kuo, Der-Ling Hsia
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Abstract
A LED sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface. The first electrical-conductive layers are positioned on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove.
Claims11
A light emitting diode sub-mount comprising:
- a substrate body having a first surface;
- and
- a plurality of first electrical-conductive layers disposed on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove.
A light emitting device manufacturing method comprising:
- providing a sub-mount, which has a plurality of electrical-conductive layers, and a surface between every adjacent two of the electrical-conductive layers has an adhesive-filling groove;
- mounting an LED chip, which has a bottom substrate, on the sub-mount by a flip-chip way, and two electrodes of the LED chip are in contact with adjacent two of the electrical-conductive layers;
- filling an glue along the adhesive-filling groove to be guided into a gap between the LED chip and the sub-mount;
- and
- removing the bottom substrate of the LED chip.
2 more elements
Dependencies are inferred from the claim text.