Method for Producing at Least One Radiation-Emitting and/or -Receiving Semiconductor Component, and Semiconductor Component

A method for producing a radiation-emitting or radiation-receiving semiconductor component, the method comprising:

• providing a carrier body having a mounting surface;
• forming a barrier frame on the mounting surface, the barrier frame laterally enclosing a mounting region of the mounting surface;
• mounting a radiation-emitting or radiation-receiving semiconductor chip within the mounting region on the mounting surface;
• applying a liquid lens material to the mounting surface within the mounting region thereby potting the semiconductor chip;
• and
• curing the liquid lens material, wherein the mounting surface, the barrier frame and the lens material are adapted to one another and wherein the lens material forms a drop, which is delimited by the barrier frame and which has a convex outer surface.

A radiation-emitting or radiation-receiving semiconductor component, comprising

• a carrier body having a mounting surface;
• a barrier frame disposed on the mounting surface, the barrier frame laterally enclosing a mounting region of the mounting surface;
• a radiation-emitting or radiation-receiving semiconductor chip disposed within the mounting region on the mounting surface;
• and
• a lens material disposed on the mounting surface within the mounting region, the lens material covering the semiconductor chip and having a convex outer surface.

A method for producing a radiation-emitting or radiation-receiving semiconductor component, the method comprising:

• providing a carrier body having a mounting surface;
• forming a barrier frame on the mounting surface thereby laterally encloses a mounting region of the mounting surface, wherein the mounting region comprising a first electrical connection area and a second electrical connection area, wherein the second electrical connection area is arranged laterally alongside the first electrical connection area, and wherein the first connection area and the second connection area are arranged completely within the barrier frame;
• and
• mounting a radiation-emitting or radiation-receiving semiconductor chip within the mounting region on the mounting surface, wherein the semiconductor chip is mounted on the first electrical connection area;
• applying a liquid lens material to the mounting surface within the mounting region thereby potting the semiconductor chip;
• and
• curing the liquid lens material, wherein the mounting surface, the barrier frame and the lens material are adapted to one another, wherein the lens material forms a drop, which is delimited by the barrier frame and which has a convex outer surface.