US 2014/0231842 A1Published application

Semiconductor light emitting device and light emitting device

AssigneeKabushiki Kaisha Toshiba

InventorsYosuke AKIMOTO, Akihiro KOJIMA, Miyoko SHIMADA, Hideyuki TOMIZAWA, Yoshiaki SUGIZAKI, Hideto FURUYAMA

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Abstract

According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, a first insulating film, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar, a second insulating film and a fluorescent material layer. The first electrode is provided in an emitting region of the semiconductor layer. The first electrode, the first insulating film, the first interconnection layer, the second interconnection layer, and the second insulating layer are configured to transmit radiated light of the light emitting layer.

Claims20

Dependent claims

A semiconductor light emitting device comprising:

a semiconductor layer having a first surface and a second surface on an opposite side to the first surface and including a light emitting layer;
a first electrode provided in an emitting region of the semiconductor layer on a side of the second surface and configured to transmit radiated light of the light emitting layer;
a second electrode provided in a non-emitting region of the semiconductor layer on the side of the second surface;
a first insulating film provided on the side of the second surface and configured to transmit the radiated light of the light emitting layer;
a first interconnection layer provided on the first insulating film, connected to the first electrode, and configured to transmit the radiated light of the light emitting layer;
a second interconnection layer provided on the first insulating film, connected to the second electrode, and configured to transmit the radiated light of the light emitting layer;
a first metal pillar provided on the first interconnection layer and having an externally connectable end;
a second metal pillar provided on the second interconnection layer and having an externally connectable end;
a second insulating film provided in contact with a side surface of the first metal pillar and a side surface of the second metal pillar between the first metal pillar and the second metal pillar and configured to transmit the radiated light of the light emitting layer;
and
a fluorescent material layer provided on a side of the first surface and including a plurality of fluorescent materials configured to be excited by the radiated light of the light emitting layer and to radiate light of a different wavelength from the radiated light of the light emitting layer and a bonding material integrating the plurality of fluorescent materials and configured to transmit the radiated light of the light emitting layer and the radiated light of the fluorescent materials.

8 more elements

A light emitting device comprising:

a mounting substrate;
and
a semiconductor light emitting device mounted on the mounting substrate,
the semiconductor light emitting device including:
a semiconductor layer having a first surface and a second surface on an opposite side to the first surface and including a light emitting layer;
a first electrode provided in an emitting region of the semiconductor layer on a side of the second surface and configured to transmit radiated light of the light emitting layer;
a second electrode provided in a nonemitting region of the semiconductor layer on the side of the second surface;
a first insulating film provided on the side of the second surface and configured to transmit the radiated light of the light emitting layer;
a first interconnection layer provided on the first insulating film, connected to the first electrode, and configured to transmit the radiated light of the light emitting layer;
a second interconnection layer provided on the first insulating film, connected to the second electrode, and configured to transmit the radiated light of the light emitting layer;
a first metal pillar provided on the first interconnection layer and connected to the mounting substrate;
a second metal pillar provided on the second interconnection layer and connected to the mounting substrate;
a second insulating film provided in contact with a side surface of the first metal pillar and a side surface of the second metal pillar between the first metal pillar and the second metal pillar and configured to transmit radiated light of the light emitting layer;
and
a fluorescent material layer provided on a side of the first surface and including a plurality of fluorescent materials configured to be excited by the radiated light of the light emitting layer and to radiate light of a different wavelength from the radiated light of the light emitting layer and a bonding material integrating the plurality of fluorescent materials and configured to transmit the radiated light of the light emitting layer and the radiated light of the fluorescent materials.

12 more elements

Dependencies are inferred from the claim text.