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US 2014/0231831 A1Published application
Led chip and method for manufacturing the same
AssigneeLextar Electronics Corporation
InventorsPEI-SHIU TSAI, Wan-Chun HUANG
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Abstract
The invention provides a substrate structure used for manufacturing a light-emitting diode and a method for manufacturing the light-emitting diode. The substrate structure includes a substrate having a first surface and a second surface opposite to the first surface and a plurality of grooving structure formed on the first surface of the substrate. The light-emitting diode is formed on the first surface of the substrate.
Claims20
A light-emitting diode die, comprising:
- a transparent substrate;
- an N-type semiconductor layer positioned on the transparent substrate;
- a light-emitting layer positioned on the N-type semiconductor layer;
- and
- a P-type semiconductor layer positioned on the light-emitting layer,
- wherein the N-type semiconductor layer, the transparent layer or both have sidewalls with a plurality of recess structures.
3 more elements
A method for manufacturing a light-emitting diode die, comprising the steps of:
- providing a transparent substrate having an upper surface;
- forming a light-emitting diode stacked structure on the upper surface of the transparent substrate, wherein the light-emitting diode stacked structure comprises:
- an N-type semiconductor layer positioned on the transparent substrate;
- a light-emitting layer positioned on the N-type semiconductor layer;
- and
- a P-type semiconductor layer positioned on the light-emitting layer;
- and
- forming a plurality of recess structures on sidewalls of the N-type semiconductor layer, the transparent substrate or both.
5 more elements
Dependencies are inferred from the claim text.