Organic light emitting diode display device and manufacturing method thereof

A manufacturing method of an organic light emitting diode display device, comprising:

• providing a first flexible substrate and a second flexible substrate;
• disposing a first barrier layer on the first flexible substrate;
• disposing a second barrier layer on the second flexible substrate;
• disposing an organic light emitting diode element on the first flexible substrate;
• forming a first patterned metal layer on the first flexible substrate and forming a second patterned metal layer on the second flexible substrate, wherein the material of the first patterned metal layer and the material of the second patterned metal layer are the same;
• assembling the first flexible substrate to the second flexible substrate;
• and
• heating the first patterned metal layer and the second patterned layer to form a metal enclosing wall, the metal enclosing wall connecting the first flexible substrate to the second flexible substrate and surrounding the organic light emitting diode element.

A manufacturing method of an organic light emitting diode display device, comprising:

• providing a first flexible substrate and a second flexible substrate;
• disposing a first barrier layer on the first flexible substrate;
• disposing a second barrier layer on the second flexible substrate;
• disposing an organic light emitting diode element on the first flexible substrate;
• forming a first metal layer on the first flexible substrate and forming a second metal layer on the second flexible substrate;
• forming a third metal layer between the first metal layer and the second metal layer, wherein the material of the third metal layer is different from the materials of the first metal layer and the second metal layer;
• providing a filler covering the organic light emitting diode element;
• assembling the first flexible substrate to the second flexible substrate;
• and
• heating the first metal layer, the second metal layer, and the third metal layer to form a metal enclosing wall, the metal enclosing wall connecting the first flexible substrate to the second flexible substrate and surrounding the organic light emitting diode element.