Negative-type photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device

A negative-type photosensitive resin composition comprising a compound represented by the following formula (1),

• wherein R1 and R2 each independently indicate a hydrogen atom or an organic group, provided that at least one of R1 and R2 indicates an organic group;
• R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond;
• R3 represents a single bond or an organic group;
• R4 and R5 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, or an organic group;
• R6, R7, R8, and R9 each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, an ammonio group, or an organic group, provided that R6 and R7 are never hydroxyl groups;
• two or more of R6, R7, R8, and R9 may be bonded to form a ring structure and may contain a hetero atom bond;
• and
• R10 represents a hydrogen atom or an organic group.