Thermoconductive resin composition
OwnerYuki Kotani, Tomokazu Kusunoki +1inventors
InventorsYuki Kotani, Tomokazu Kusunoki, Hiroyoshi Yoden
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Abstract
The present invention provides a thermally conductive resin composition which can realize high thermal conduction without increasing a content of a thermally conductive filler by including a specific thermally conductive inorganic filler, and also exhibits satisfactory moldability. Disclosed is a thermally conductive resin composition, including: a thermally conductive filler; and a binder resin, wherein the thermally conductive resin composition contains, as the thermally conductive filler, an irregularly shaped filler having projection/recess structures on its surface.
Claims10
A thermally conductive resin composition, comprising:
- a thermally conductive filler;
- and
- a binder resin,
- wherein the thermally conductive resin composition contains, as the thermally conductive filler, an irregularly shaped filler having projection/recess structures on its surface.
Dependencies are inferred from the claim text.