Multichip wafer level package (wlp) optical device

An optical device comprising:

• a carrier substrate having a surface, the surface including at least a first cavity and a second cavity formed therein;
• a light source disposed in the first cavity, the light source configured to emit light in a predetermined spectrum of wavelengths;
• a sensor disposed in the second cavity, the sensor configured to detect light in the predetermined spectrum of wavelengths and to provide a signal in response thereto;
• a glass cover disposed on the surface of the carrier substrate so that the cover at least substantially encloses the light source within the first cavity and the sensor within the second cavity, the glass cover configured to transmit light within the predetermined spectrum of wavelengths;
• a first lens assembly disposed in the glass cover over the first cavity to collimate light emitted by the light source;
• a second lens assembly disposed in the glass cover over the second cavity to collimate light incident on the second lens assembly and to pass the collimated light to the sensor;
• and
• at least one through-substrate-via (TSV) disposed in the carrier substrate, the through-substrate-via extending from one of the first cavity or the second cavity through the carrier substrate to furnish electrical connection to at least one of the light source or the sensor.

A method for fabricating an optical device comprising:

• forming a plurality of first cavities and a plurality of second cavities in a surface of a wafer;
• mounting a light source in respective ones of the plurality of first cavities, the light source configured to emit light in a predetermined spectrum of wavelengths;
• mounting a sensor in respective ones of the plurality of second cavities, the sensor configured to detect light in the predetermined spectrum of wavelengths and to provide a signal in response thereto;
• attaching a cover to the wafer so that the cover at least substantially encloses the light source within the first cavity and the sensor within the second cavity, the cover configured to transmit light within the predetermined spectrum of wavelengths;
• forming at least one through-substrate-via (TSV) in the wafer, the through-substrate-via extending from one of the first cavity or the second cavity through the wafer to furnish electrical connection to at least one of the light source or the sensor;
• and
• singulating the wafer and cover attached thereto to form an optical device, the optical device comprising at least one first cavity having a light source disposed therein, at least one second cavity having a sensor disposed therein, and at least one through-substrate-via.

An optical device comprising:

• a carrier substrate having a surface, the surface including at least a first cavity and a second cavity formed therein;
• an optical component device disposed in the first cavity;
• a sensor disposed in the second cavity, the sensor configured to detect light in a predetermined spectrum of wavelengths and to provide a signal in response thereto;
• and
• a cover disposed on the surface of the carrier substrate so that the cover at least substantially encloses the optical component device within the first cavity and the sensor within the second cavity, the cover configured to transmit light within the predetermined spectrum of wavelengths.