Electronic component mounting method, electronic component placement machine, and electronic component mounting system

An electronic component placement machine adapted to place a first electronic component on a substrate, the first electronic component having a principal surface provided with a plurality of bumps, the substrate having a plurality of first electrodes corresponding to the plurality of bumps, the machine comprising:

• a first component feeding unit for feeding the first electronic component;
• a substrate holding zone configured to hold and position the substrate;
• a transfer unit for providing a film of flux;
• a movable placing head for placing the fed first electronic component on the substrate;
• a movable dispensing head for dispensing a thermosetting resin;
• and
• a control unit for controlling movements and operations of the placing head and the dispensing head, wherein
• in response to commands from the control unit, the placing head transfers the film of flux to the plurality of bumps on the first electronic component, using the transfer unit, and then places the first electronic component on the substrate such that the bumps land on the corresponding first electrodes via the flux;
• and the dispensing head dispenses the thermosetting resin onto at least one reinforcement position on the substrate with the first electronic component placed thereon, the at least one reinforcement position corresponding to a peripheral edge portion of the first electronic component, the thermosetting resin dispensed so as to come in contact with the peripheral edge portion.

An electronic component mounting method in which a first electronic component and a second electronic component are mounted on a substrate, the first electronic component having a principal surface provided with a plurality of bumps, the second electronic component having a connection terminal, the substrate having a plurality of first electrodes corresponding to the plurality of bumps and a second electrode corresponding to the connection terminal, the method comprising the steps of:

• providing the substrate;
• applying a paste containing metal particles by screen printing to the second electrode on the substrate;
• providing the first electronic component;
• providing the second electronic component;
• applying flux to the plurality of bumps;
• placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes via the flux;
• dispensing a thermosetting resin onto at least one reinforcement position on the substrate with the first electronic component placed thereon, the at least one reinforcement position corresponding to a peripheral edge portion of the first electronic component, the thermosetting resin dispensed so as to come in contact with the peripheral edge portion;
• placing the second electronic component on the substrate such that the connection terminal lands on the second electrode via the paste containing metal particles;
• and
• heating the substrate with the first electronic component and the second electronic component placed thereon, to melt the bumps and the metal particles, and cure the thermosetting resin, followed by cooling, thereby to join the first electronic component and the second electronic component to the substrate.

An electronic component mounting system adapted to mount a first electronic component and a second electronic component on a substrate, the first electronic component having a principal surface provided with a plurality of bumps, the second electronic component having a connection terminal, the substrate having a plurality of first electrodes corresponding to the plurality of bumps and a second electrode corresponding to the connection terminal,

• the system comprising:
• a substrate feeding machine for feeding the substrate;
• a screen printing machine for applying a paste containing metal particles by screen printing to the second electrode on the substrate carried from the substrate feeding machine;
• an electronic component placement machine for placing the first electronic component and the second electronic component on the first electrodes and the second electrode, respectively, on the substrate carried from the screen printing machine, the second electrode having the paste containing metal particles applied thereto;
• and
• a reflow machine for heating the substrate carried from the electronic component placement machine, to melt the bumps and the metal particles, and cure the thermosetting resin, wherein
• the electronic component placement machine comprises:
• a first component feeding unit for feeding the first electronic component;
• a second component feeding unit for feeding the second electronic component;
• a substrate holding zone configured to hold and position the substrate;
• a transfer unit for providing a film of flux;
• a movable placing head for placing the fed first electronic component and the fed second electronic component on the substrate;
• a movable dispensing head for dispensing the thermosetting resin;
• and
• a control unit for controlling movements and operations of the placing head and the dispensing head, wherein
• in response to commands from the control unit, the placing head transfers the film of flux to the plurality of bumps on the first electronic component, using the transfer unit, and then places the first electronic component on the substrate such that the bumps land on the corresponding first electrodes via the flux and places the second electronic component on the substrate such that the connection terminal lands on the second electrode via the paste containing metal particles;
• and the dispensing head dispenses the thermosetting resin onto at least one reinforcement position on the substrate with the first electronic component placed thereon, the at least one reinforcement position corresponding to a peripheral edge portion of the first electronic component, the thermosetting resin dispensed so as to come in contact with the peripheral edge portion.