Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes

A method for creating a probe structure for contacting electronic components wherein the probe structure comprises a contact tip for contacting a first electronic component, a compliant body that comprises a distal end that is in contact with the contact tip and a proximal end for mounting to a second electronic component and an intermediate portion that extends from the distal end to the proximal end, and a bonding material for attaching the proximal end to a second electronic component, the method comprising:

• a) forming at least a portion of the compliant body from one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one structural material and wherein at least one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer, wherein the compliant body comprises at least one of the at least one structural material;
• b) forming a body of a bonding material from one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one bonding material and wherein at least one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer;
• and
• c) forming the contact tip from at least a portion of one or more multiple material layers of electrodeposited material, wherein at least one of the multiple materials is at least one structural material and wherein at least one of the multiple materials is at least one sacrificial material and wherein at least a plurality of the multiple materials are planarized to set a boundary level for each layer, and wherein during electrodeposition the contact tip is formed from at least one of the at least one structural material,
• wherein each successive layer is formed and simultaneously adhered to a previously formed layer.