Metal plating method and apparatus
AssigneePratt & Whitney Canada Corp.
InventorJEROME JAMES
Life of this patent
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Abstract
An apparatus and a method suited for metal plating aircraft engine components that allows the creation a local environment for plating by covering a localized area to be plated so that the localized area to be plated is sealed from remaining parts of the component, thereby eliminating the need for masking remaining parts of the component prior to plating.
Claims10
An electroplating apparatus for use in plating a desired surface area of a conductive component adapted to be charged as a cathode during a plating process, the apparatus comprising an injection head sized and shaped to circumscribe the desired surface area to be plated and isolate same from the remainder of the conductive component, the injection head and the desired surface area defining a localized plating chamber therebetween, an anode provided on the injection head and disposed to face the surface area to be plated when the injection head is positioned on the conductive component, a supply passage defined in said injection head for allowing a plating solution to be supplied into said localized plating chamber, and an electric contact for connecting the anode to a negative side of a power supply.
Dependencies are inferred from the claim text.