Adjustable current shield for electroplating processes

A plating apparatus, comprising:

• a substrate holder that is adapted to receive a substrate;
• an anode;
• and
• an adjustable current shield positioned between said substrate holder and said anode,
• wherein said adjustable current shield comprises:
• a stationary member;
• a moveable member that is adapted to be moved relative to said stationary member;
• and
• a plurality of current shield members operatively coupled to said stationary member and said moveable member, wherein each of said plurality of current shield members is rotatably pinned to one of said stationary member or said moveable member and wherein a portion of each of said current shield members is adapted to be moved inward or outward when there is relative movement between said moveable member and said stationary member depending upon the direction of such relative movement.

A plating apparatus, comprising:

• a substrate holder that is adapted to receive a substrate;
• an anode;
• and
• an adjustable current shield positioned between said substrate holder and said anode,
• wherein said adjustable current shield comprises:
• a stationary ring;
• a moveable ring that is adapted to be moved relative to said stationary ring;
• and
• a plurality of current shield members operatively coupled to said stationary ring and said moveable ring, wherein each of said plurality of current shield members is rotatably pinned to one of said stationary ring or said moveable ring and wherein each of said current shield members is adapted to rotate when there is relative movement between said moveable ring and said stationary ring, thereby moving a portion of each of said current shield members radially inward or outward depending upon the direction of such relative movement.

A plating apparatus, comprising:

• a substrate holder that is adapted to receive a substrate;
• an anode;
• and
• an adjustable current shield positioned between said substrate holder and said anode,
• wherein said adjustable current shield comprises:
• a stationary ring;
• a moveable ring that is adapted to be moved relative to said stationary ring;
• and
• a plurality of current shield members operatively coupled to said stationary ring and said moveable ring, wherein each of said plurality of current shield members is rotatably pinned to said stationary ring and wherein each of said current shield members is adapted to rotate when said moveable ring is moved relative to said stationary ring, thereby moving a portion of each of said current shield members radially inward or outward depending upon the direction of movement of said moveable ring relative to said stationary ring.

A plating apparatus, comprising:

• a substrate holder that is adapted to receive a substrate;
• an anode;
• and
• an adjustable current shield positioned between said substrate holder and said anode, wherein said adjustable current shield comprises a plurality of segmented shielding members that may be moved so as to effectively change a size of an opening of said adjustable current shield.