Multi-Finish Printed Circuit Board
AssigneeLutron Electronics Co., Inc.
InventorDavid Manero
Life of this patent
Estimating the term…
Abstract
A multi-finish printed circuit board may include one or more electrically conductive elements, such as through hole pads, that may have a first surface finish and one or more electrically conductive elements, such as surface mount pads, that may have a second surface finish that is different from the first surface finish. The first surface finish may be a hot air solder leveling (HASL) surface finish or a lead-free hot air solder leveling (LF HASL) surface finish and the second surface finish may be an organic surface protector (OSP) surface finish. The second surface finish may be applied to one or more electrically conductive elements from which the first surface finish was removed.
Claims29
A printed circuit board, comprising:
- a substrate body;
- an electrically conductive through hole pad disposed on the substrate body, the through hole pad having a hot air solder leveling (HASL) surface finish applied thereto;
- and
- an electrically conductive surface mount pad disposed on the substrate body, the surface mount pad having an organic surface protection (OSP) surface finish applied thereto.
A printed circuit board, comprising:
- a substrate body;
- a first electrically conductive element disposed on the substrate body, the first electrically conductive element having a first surface finish;
- and
- a second electrically conductive element disposed on the substrate body, the second electrically conductive element having a second surface finish that is different from the first surface finish.
A method for manufacturing a printed circuit board, the method comprising:
- providing a substrate having a substrate body and first and second electrically conductive elements disposed on the substrate body;
- applying a first surface finish to the first electrically conductive element;
- and
- applying a second surface finish to the second electrically conductive element, wherein the second surface finish is different from the first surface finish.
A printed circuit board manufactured in accordance with a process, the process comprising:
- providing a substrate having a substrate body and first and second electrically conductive elements disposed on the substrate body;
- applying a first surface finish to the first electrically conductive element;
- and
- applying a second surface finish to the second electrically conductive element, wherein the second surface finish is different from the first surface finish.
Dependencies are inferred from the claim text.