Structures for z-axis interconnection of multilayer electronic substrates
AssigneesIntegral Technology, Inc., Ormet Circuits, Inc.
InventorsChristopher A Hunrath, Khang Duy Tran, Catherine A Shearer, Kenneth C Holcomb, G Delbert Friesen
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Abstract
Invention z-axis interconnection structures provide a means to mechanically and electrically interconnect layers of metallization in electronic substrates reliably and in any configuration. Invention z-axis interconnection structures comprise a novel bonding film and conductive paste and one- and two-piece building block structures formed therefrom.
Claims41
An electronic substrate z-axis interconnection structure comprising:
- a. a bonding film comprising:
- i. a reinforcing matrix of c-stage thermosetting resin surrounded by a b-stage thermosetting resin;
- and
- ii. optionally, a particulate filler;
- b. at least one hole traversing the bonding film, wherein the at least one hole is filled with a conductive paste.
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An electronic substrate z-axis interconnection assembly comprising:
- a. an electronic substrate substructure bearing at least one bump formed from a conductive paste that was optionally deposited by a method selected from the group consisting of dispensing, jetting, screen printing, stencil printing, pad transfer and gravure, wherein the substrate substructure is optionally selected from the group consisting of a metal foil, a preform, a clip, a lead frame, a tape, a dielectric sheet optionally comprising patterned or unpatterned metallization on one or both major surfaces, and a core, wherein the dielectric sheet optionally comprises a material selected from the group consisting of:
- a ceramic, a glass, a thermoplastic polymer, a thermosetting polymer and a combination thereof;
- and
- b. an electronic substrate z-axis interconnection structure comprising at least one hole traversing the bonding film, wherein said at least one hole aligns with said at least one bump.
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Dependencies are inferred from the claim text.