Base material for forming electroconductive pattern, circuit board, and method for producing each
AssigneeFUJIFILM Corporation
InventorTakeichi TATSUTA
Life of this patent
Estimating the term…
Loading patent…
AssigneeFUJIFILM Corporation
InventorTakeichi TATSUTA
Estimating the term…
The present invention pertains to: a base material for forming an electroconductive pattern, adapted to form an electroconductive pattern and obtain a circuit board; the circuit board obtained therefrom; and a method for producing each. The base material for forming an electroconductive pattern, adapted to obtain a circuit board, includes a supporter, and a holding region for holding a fluid body for obtaining an electroconductive pattern, the holding region being formed atop one end surface of the supporter and exhibiting a proper wettability for the fluid body. The holding region has at least a first linear group including a plurality of first lines extending in parallel with each other along a first direction, and a second linear group including a plurality of second lines extending in parallel with each other along a second direction, and a grid shape is formed by the first linear group and second linear group.
A conductive pattern-forming substrate, on which a conductive pattern is formed to produce a circuit board, comprising:
A method for producing a conductive pattern-forming substrate, on which a conductive pattern is formed to produce a circuit board, comprising a step of forming a holding region on a support,
Dependencies are inferred from the claim text.