Epoxy resin compound and radiant heat circuit board using the same
AssigneeLG Innotek Co., Ltd.
InventorsJae Man Park, Eun Jin Kim, Hae Yeon Kim, Hyun Gyu Park, Yun Ho An, In Hee Cho
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Abstract
An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
Claims18
An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler,
- wherein the epoxy resin comprises an epoxy resin of the following chemical formula:
- where m is an integer of 0 to 50, R is hydrogen or an alkyl group.
A radiant heat circuit board comprising:
- a metal plate;
- an insulating layer on the metal plate;
- and
- a circuit pattern on the insulating layer,
- wherein the insulating layer is formed by curing an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, and the epoxy resin is represented by the following chemical formula:
- where m is an integer of 0 to 50, and R is hydrogen or alkyl group.
Dependencies are inferred from the claim text.