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US 2014/0231018 A1Published application
Plasma processing apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsYoshifumi AOKI, Makoto SAITO, Hideo ETO
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Abstract
In one aspect there is provided a plasma processing apparatus including a substrate placing unit configured to be placed a substrate to be processed, and an upper electrode opposed to the substrate placing unit, wherein an outer portion of a main surface of the upper electrode opposed to the substrate placing unit has a mirror surface.
Claims7
A plasma processing apparatus, comprising:
- a substrate placing unit configured to hold a substrate to be processed;
- and
- an upper electrode opposed to the substrate placing unit;
- wherein an outer portion of a main surface of the upper electrode opposed to the substrate placing unit has a mirror surface.
1 more element
Dependencies are inferred from the claim text.