Ultrathin Laminates
AssigneeIsola USA Corp.
InventorsJohann R. Schumacher, Steven M. Schultz, Stanley E. Wilson, Tarun Amla
Life of this patent
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Abstract
Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.
Claims21
A method for manufacturing an ultrathin laminate material comprising the steps of:
- placing a first copper foil sheet having into contact with a first planar surface of a fabric sheet having a thickness of from 10 to about 30 microns wherein the fabric sheet is impregnated with a resin or a layer of resin lies between the first copper foil sheet and the fabric sheet first planar surface or both to form a layup;
- and
- applying pressure and heat to the layup for a time sufficient to essentially fully cure the resin to form a laminate sheet having a base laminate thickness of from about 1.0 to about 1.75 mils.
A method for manufacturing an ultrathin laminate material comprising the steps of:
- placing a first copper foil sheet having into contact with a first planar surface of a woven glass fabric sheet having a thickness of from 10 to about 30 microns wherein the fabric sheet is impregnated with a resin or a layer of resin lies between the first copper foil sheet and the fabric sheet first planar surface or both;
- and
- applying pressure and heat to the stacked material for a time sufficient to essentially fully cure the resin to form a laminate sheet having an average minimum dielectric thickness of no less than about 0.80 mils and an average maximum dielectric thickness of no greater than about 1.2 mils.
A method for manufacturing an ultrathin laminate material comprising the steps of:
- forming at least one resin coated copper sheet including a copper foil sheet having a b-staged resin layer on one surface of the copper foil sheet;
- placing the at least one resin coated copper foil sheet into contact with a first planar surface of a fabric sheet having a thickness of from 10 to about 30 microns such that the b-staged resin layer lies between the copper foil sheet and the fabric sheet first planar surface to form a layup;
- and
- curing the resin layer to form an ultrathin laminate sheet including a c-staged resin.
A method for manufacturing an ultrathin laminate material comprising the steps of:
- forming a first resin coated copper sheet and a second resin coated copper sheet each of the first and second resin coated copper sheets including a copper foil sheet having a b-staged resin layer on one surface of the copper foil sheet;
- placing the first resin coated copper foil sheet into contact with a first planar surface of a fabric sheet having a thickness of from 10 to about 30 microns such that the b-staged resin layer lies between the copper foil sheet and the fabric sheet first planar surface and placing the second resin coated copper foil sheet into contact with a second planar surface of the fabric sheet such that the b-staged resin layer lies between the copper foil sheet and the fabric sheet second planar surface to form a layup;
- and
- curing the b-staged resin layers by applying heat and pressure to the layup to form an ultrathin laminate sheet including c-staged resin wherein the ultrathin laminate sheet has a dielectric thickness ranging from about 0.8 to about 1.2 mils.
Dependencies are inferred from the claim text.