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US 2014/0230848 A1Published application
Method of cleaning substrate
AssigneesHoya Corporation, Osaka University
InventorsKazuto YAMAUCHI, Tsutomu SHOKI, Takeyuki YAMADA
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Abstract
The present invention is a method of cleaning a substrate, comprising cleaning at least one surface of a substrate located in a liquid by injecting pressurized cleaning liquid containing bubbles or cleaning particles from a injection nozzle to at least one surface of the substrate.
Claims8
A method of cleaning a substrate, comprising cleaning at least one surface of the substrate by injecting pressurized cleaning liquid from a injection nozzle to the at least one surface of the substrate, wherein
- the cleaning liquid containing bubbles or cleaning particles is supplied to the nozzle with pressurized state,
- the substrate and the nozzle are located in a liquid, and
- the pressurized cleaning liquid is injected from the injection nozzle to the liquid, so that the at least one surface of the substrate is cleaned by the pressurized cleaning liquid that is injected to the liquid.
Dependencies are inferred from the claim text.