In-circuit test structure for printed circuit board
AssigneeNVIDIA Corporation
InventorsJinchai (Ivy) QIN, Bing AI
Life of this patent
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Abstract
A printed circuit board, an in-circuit test structure and a method for producing the in-circuit test structure thereof are disclosed. The in-circuit test structure comprises a via and a test pad. The via passes through the printed circuit board for communicating with an electrical device to be tested on the printed circuit board. The test pad is formed on an upper surface of the printed circuit board and covering the via, wherein a center of the via deviates from a center of the test pad. In the in-circuit test, the accuracy of the test data can be improved by means of the in-circuit test structure provided by the present invention, and thus the reliability of the test result is ensured. Also, the test efficiency of the in-circuit test is improved.
Claims20
An in-circuit test structure for a printed circuit board, the test structure comprising:
- a via passing through the printed circuit board for electrically conducting with an electrical device to be tested on the printed circuit board;
- and
- a test pad formed on an upper surface of the printed circuit board and covering the via, wherein a center of the via deviates from a center of the test pad.
A printed circuit board, comprising a multilayer stack structure;
- and an in-circuit test structure, wherein the in-circuit structure comprises:
- a via passing through the printed circuit board and communicating with an electrical device to be tested on the printed circuit board;
- and
- a test pad formed on an upper surface of the printed circuit board and covering the via, wherein a center of the via deviates from a center of the test pad.
A method for producing an in-circuit test structure for a printed circuit board, said method comprising:
- forming a via in the printed circuit board that has a multilayer stack structure, wherein the via passes through the printed circuit board and electrically conducts with an electrical device to be tested on the printed circuit board;
- and
- forming a test pad on an upper surface of the printed circuit board, wherein the test pad covers the via, and wherein a center of the via deviates from a center of the test pad.
Dependencies are inferred from the claim text.