Polyimides, coating composition formed therefrom and use thereof
AssigneeEternal Chemical Co., Ltd.
InventorsMeng-Yen Chou, Chung-Jen Wu
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Abstract
A polyimide (PI) having two —COOH capping groups at each end is provided. A coating composition is further provided, which contains the PI and a hardening agent having 2 to 6 functional groups capable of reacting with —COOH. A PI coating layer and PI film formed by the coating composition of the present invention possess excellent chemical resistance and coefficient of thermal expansion (CTE), which makes them applicable in fabrication of protective materials for active/passive devices, optical materials, touch panels, copper foil substrates, soft flexible electronic materials or integrated circuit elements, or film substrate for glass film touch panels.
Claims12
A polyimide (PI) having a structure represented by Formula (I),
- wherein:
- A, C and E are the same or different and are each independently a tetravalent organic group, and if n is greater than 1, each C is the same or a different tetravalent organic group;
- each B is the same or different, and is independently a divalent organic group;
- and
- n is an integer greater than 0.
Dependencies are inferred from the claim text.