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AssigneeSlipnaxos Aktiebolag
InventorsMichael Tholin, Fredrik Westberg, Stefan Bergh, Ida Johansson
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The invention relates to a grinding tool for machining brittle materials. The grinding tool has a core and an abrasive rim. The abrasive rim has abrasive particles embedded in a matrix. The matrix has a metallic bonding agent and possibly also a polymeric bonding agent. The metallic bonding agent contains silicon nitride in an amount that constitutes 0.02%-5.0% by volume of the metallic bonding agent. The invention also relates to a method of manufacturing the grinding tool. In the method, abrasive particles are mixed with metal powder and silicon nitride and the mixture is sintered. Polymeric powder may also be added before sintering.
A grinding tool for machining hard and/or brittle materials which grinding tool comprises a core and an abrasive rim, the abrasive rim comprising abrasive particles embedded in a matrix, the matrix comprising a metallic bonding agent which is a sintered bronze alloy, the metallic bonding agent constituting 50%-100% by volume of the matrix, the metallic bonding agent containing silicon nitride in an amount that constitutes 0.02%-5.0% by volume of the metallic bonding agent characterized in that the silicon nitride is present in the shape of grains having an average grain size which is less than 10 μm and above 0.1 μm.
A method of making a grinding tool which method comprises sintering abrasive particles together with metallic powder that comprises copper and tin such that the sintering results in a matrix in which the abrasive particles are embedded, the matrix comprising a metallic bonding agent which is a sintered bronze alloy, characterized in that silicon nitride in the form of a powder is added to the metallic powder before sintering and to such an extent that the silicon nitride will constitute 0.02%-5.0% by volume of the metallic bonding agent and wherein the silicon nitride which is added is in the shape of grains having an average grain size which is less than 10 μm and above 0.1 μm.
Dependencies are inferred from the claim text.