Process and apparatus for treating surfaces of wafer-shaped articles
AssigneeLam Research Corporation
InventorsPhilipp ENGESSER, David HENRIKS, Anders Joel BJOERK
Life of this patent
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Abstract
An apparatus and method for processing wafer-shaped articles utilizes at least first and second liquid-dispensing nozzles, wherein a first liquid-dispensing nozzle is positioned closer to an axis of rotation than the second liquid-dispensing nozzle. A liquid supply system supplies heated process liquid to the nozzles such that process liquid dispensed from the first nozzle has a temperature that differs by an amount within a predetermined range from a temperature of process liquid dispensed from the second liquid-dispensing nozzle.
Claims15
Apparatus for processing wafer-shaped articles, comprising:
- a rotary chuck adapted to hold a wafer shaped article of a predetermined diameter thereon and to rotate the wafer shaped article about an axis of rotation,
- at least first and second liquid-dispensing nozzles that are mounted so as to be stationary relative to one another, wherein said first liquid-dispensing nozzle is positioned closer to said axis of rotation than said second liquid-dispensing nozzle, and
- a liquid supply system configured to supply process liquid to said first and second liquid-dispensing nozzles, said liquid supply system comprising one or more heaters, and said liquid supply system being configured to heat and supply process liquid such that process liquid dispensed from said first liquid-dispensing nozzle has a temperature that differs by an amount within a predetermined range from a temperature of process liquid dispensed from said second liquid-dispensing nozzle.
A method for processing wafer-shaped articles, comprising:
- positioning a wafer shaped article of a predetermined diameter on a rotary chuck and rotating the wafer shaped article about an axis of rotation, dispensing process liquid onto the wafer-shaped article through at least first and second liquid-dispensing nozzles, wherein the first liquid-dispensing nozzle is positioned closer to the axis of rotation than the second liquid-dispensing nozzle, and
- controlling at least one of a flow rate and temperature of process liquid dispensed from the first and second liquid-dispensing nozzles such that process liquid dispensed in a more central region of the wafer-shaped article has a temperature that differs by an amount within a predetermined range from a temperature of process liquid dispensed in a more peripheral region of the wafer-shaped article.
Dependencies are inferred from the claim text.