Substrate processing apparatus and substrate processing method

A substrate processing apparatus for processing a substrate, comprising:

• a sealed space forming part forming an internal space which is sealed;
• a sealed space opening and closing mechanism for moving a movable part which is part of said sealed space forming part relatively to the other portion, to thereby open and close said sealed space forming part;
• a substrate holding part disposed in said sealed space forming part, for holding a substrate in a horizontal state;
• a chemical liquid supply part for supplying a chemical liquid onto an upper surface of said substrate;
• an inert gas supply part for supplying an inert gas into said internal space;
• a gas exhaust part for exhausting gas from said internal space;
• and
• a control part for controlling said inert gas supply part to supply said inert gas into said internal space while controlling said gas exhaust part to exhaust gas from said internal space, to thereby bring said internal space which is sealed into an inert gas filled state, and for stopping supply of said inert gas into said internal space and exhaust of gas from said internal space when controlling said chemical liquid supply part to supply said chemical liquid onto said substrate in said inert gas filled state.

A substrate processing method of processing a substrate in a substrate processing apparatus, wherein

• said substrate processing apparatus comprises:
• a sealed space forming part forming an internal space which is sealed;
• a sealed space opening and closing mechanism for moving a movable part which is part of said sealed space forming part relatively to the other portion, to thereby open and close said sealed space forming part;
• a substrate holding part disposed in said sealed space forming part, for holding a substrate in a horizontal state;
• a chemical liquid supply part for supplying a chemical liquid onto an upper surface of said substrate;
• an inert gas supply part for supplying an inert gas into said internal space;
• and
• a gas exhaust part for exhausting gas from said internal space,
• said substrate processing method comprising:
• a) supplying said inert gas into said internal space by said inert gas supply part while exhausting gas from said internal space by said gas exhaust part, to thereby bring said internal space which is sealed into an inert gas filled state;
• and
• b) supplying said chemical liquid onto said substrate in said inert gas filled state by said chemical liquid supply part,
• wherein supply of said inert gas into said internal space and exhaust of gas from said internal space are stopped when said chemical liquid is supplied onto said substrate in said operation b).