Method for Producing Group III Nitride Semiconductor
AssigneeToyoda Gosei Co., Ltd.
InventorsKoji OKUNO, Takahide OSHIO, Naoki SHIBATA, Hiroshi AMANO
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AssigneeToyoda Gosei Co., Ltd.
InventorsKoji OKUNO, Takahide OSHIO, Naoki SHIBATA, Hiroshi AMANO
Estimating the term…
Group III nitride semiconductor having reduced threading dislocation density and uniform Ga-polar surface is provided. Forming a capping layer on a buffer layer containing Al as an essential element at a temperature lower than a temperature at which an oxide of element constituting the buffer layer is formed. Heat treating the substrate having the buffer layer covered by the capping layer at a temperature higher than a temperature at which a crystal of body semiconductor grows without exposing the surface of the buffer layer. The substrate temperature is decreased to a temperature at which a crystal of the body semiconductor grows and the body semiconductor is grown.
A method for growing Group III nitride semiconductor on a substrate made of a material different from Group III nitride semiconductor, the method comprising:
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