Methods of trimming nanowire structures
AssigneeGlobalfoundries Inc.
InventorsNicholas V. LiCausi, Jeremy A. Wahl
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Abstract
One illustrative method disclosed herein includes forming an initial nanowire structure having an initial cross-sectional size, performing a doping diffusion process to form an N-type doped region in the initial nanowire structure and performing an etching process to remove at least a portion of the doped region and thereby define a final nanowire structure having a final cross-sectional size, wherein the final cross-sectional size is smaller than the initial cross-sectional size.
Claims29
A method of forming a device, comprising:
- forming an initial nanowire structure having an initial cross-sectional size;
- performing a doping diffusion process to form an N-type doped region in said initial nanowire structure;
- and
- performing an etching process to remove at least a portion of said doped region and thereby define a final nanowire structure having a final cross-sectional size, wherein said final cross-sectional size is smaller than said initial cross-sectional size.
A method of forming a device, comprising:
- forming an initial nanowire structure having an initial cross-sectional size;
- performing a doping diffusion process to form an N-type doped region in said initial nanowire structure, wherein said doping diffusion process is performed at a temperature that falls within the range of about 600-1100° C. and wherein said doped region has a dopant concentration of N-type dopant material that falls within the range of about 1019-1021 atoms/cm3;
- and
- performing an etching process to remove at least a portion of said doped region and thereby define a final nanowire structure having a final cross-sectional size, wherein said final cross-sectional size is smaller than said initial cross-sectional size.
A method of forming a device, comprising:
- forming an initial nanowire structure having an initial cross-sectional size;
- performing a doping diffusion process to form an N-type doped region in said initial nanowire structure, wherein said doping diffusion process is performed at a temperature that falls within the range of about 600-1100° C. and wherein said doped region has a dopant concentration of N-type dopant material that falls within the range of about 1019-1021 atoms/cm3;
- and
- performing a chlorine-based etching process to remove at least a portion of said doped region and thereby define a final nanowire structure having a final cross-sectional size, wherein said final cross-sectional size is about 20-80% smaller than said initial cross-sectional size.
Dependencies are inferred from the claim text.