Process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc)

An integrated circuit (IC) packaging method, comprising:

• providing a substrate having a dielectric on a first side of the substrate;
• depositing a packaging connection in an opening formed in the dielectric so that the packaging connection couples to a contact pad of the substrate;
• depositing first mold compound on the dielectric to surround the packaging connection;
• attaching a die to a second side of the substrate opposite the first side of the substrate;
• depositing second mold compound to the second side of the substrate to surround the die;
• and
• exposing the package connection through the first mold compound.

An integrated circuit (IC) packaging method, comprising:

• depositing first mold compound on a dielectric located on a first side of a substrate;
• attaching a die to a second side of the substrate opposite the first side of the substrate;
• depositing second mold compound to the second side of the substrate to surround the die;
• and
• depositing a packaging connection on the first side of the substrate that couples to a contact pad of the substrate through the first mold compound and the dielectric.