Method for incorporating stress sensitive chip scale components into reconstructed wafer based modules
AssigneeThe Charles Stark Draper Laboratory, Inc.
InventorMaurice Karpman
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Abstract
Techniques for constructing an electronic module are provided herein. For example, the techniques include orienting at least one die having a top side (e.g., a first side), a bottom side (e.g., a second side) and one or more side walls, on a substrate with the top side of the die proximate the substrate, coating the bottom side and each of the side walls of the die with a stress buffer material, forming a reconstructed wafer by encapsulating the coated die within a mold compound, and removing the substrate to expose the top side of the die.
Claims16
A method for constructing an electronic module having a die with a first side opposing a second side and a sidewall extending between the first side and second side, the method comprising the steps of:
- orienting the die on a substrate with the first side of the die proximate the substrate;
- coating the second side and the side wall the die with a stress buffer material;
- forming a reconstructed wafer by encapsulating the coated die within a mold compound;
- and
- removing the substrate to expose the first side of the die.
A method for constructing an electronic module, the method comprising the steps of:
- orienting at least one primary die having a top side, a bottom side and one or more side walls on a substrate with the top side of the die proximate the substrate;
- forming a reconstructed wafer by encapsulating the primary die within a mold compound;
- removing the substrate to expose the top side of the primary die and a top side of the reconstructed wafer, the top side of the primary die and the top side of the reconstructed wafer being substantially co-planar;
- forming a cavity in the reconstructed wafer, the cavity having a bottom and defining one or more side walls in the reconstructed wafer extending from the bottom of the cavity and terminating at the top side of the reconstructed wafer;
- and
- disposing a secondary die having a front side, a bottom side and one or more side walls in the cavity such that the bottom side of the secondary die is proximate the bottom of the cavity.
A method for constructing an electronic module, the method comprising:
- orienting at least one primary die having a top side, a bottom side and one or more side walls on a substrate with the top side proximate the substrate;
- forming a reconstructed wafer by encapsulating the primary die within a mold compound, the reconstructed wafer defined by one or more side walls separating a top side and a bottom side;
- removing the substrate from the primary die and the reconstructed wafer exposing the top side of the reconstructed wafer and the top side of the primary die;
- disposing one or more metal layers on the top side of the reconstructed wafer and the top side of the primary die to form a front side interconnect layer;
- forming a cavity in the reconstructed wafer;
- and
- disposing a secondary die in the cavity.
Dependencies are inferred from the claim text.