Sensor array package
AssigneeApple Inc.
InventorsShawn X. Arnold, Terry L. Gilton, Matthew E. Last
Life of this patent
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Abstract
Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.
Claims20
A method of forming a low profile assembly, comprising:
- forming a signal trench in a substrate;
- depositing a barrier layer over the substrate proximate the signal trench;
- depositing a seed layer of metal in the signal trench;
- depositing a masking layer over the substrate, the barrier layer, and the signal trench;
- depositing and additional metal over the masking layer;
- and
- removing the masking layer and the seed layer to form a final conductive layer in the signal trench.
A method of fabricating a low profile assembly having a first substrate smaller than a second substrate, the first substrate disposed on the second substrate, the method comprising:
- forming a signal trench disposed on a first side of the second substrate, the signal trench configured to support bond wire connections to the first substrate below a surface plane of the first substrate.
A method of forming a low profile integrated circuit assembly, comprising:
- depositing a first layer over a first component on a substrate;
- depositing a second layer over the first layer and the substrate;
- applying a masking layer to a portion of the second layer to define a shape for a third layer;
- and
- after applying the masking layer, depositing the third layer over the masking layer, wherein the third layer includes a metallic material.
Dependencies are inferred from the claim text.